BGA rework

The rework of PCB components is a challenging task, especially when PCs (eg mobile phones, XBOXs, etc.) need to be saved, prototypes, laboratories, etc. On the devices in this category it is possible to repair BGA components, QFN, and other components.

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Vacuum Pick-Up Unit VM-045

Vacuum Pick-Up “Pen” has been designed as a tool for a safe and comfortable manipulations with SMD electronic components from size 0402
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Bottom heater module NP10-6 Pro

Preheater NP 10-6 Pro with a heating surface of 105 x 65 mm. Heating power 350 W, temperature range 50 - 350 °C.
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Bottom heater module NP17-12 Pro

Preheater NP 17-12 Pro with a heating surface of 170 x 120 mm. Heating power 700 W, temperature range 50 - 350 °C.
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Bottom heater module NP24-17 Pro

Preheater NP 24-17 Pro with a heating surface of 240 x 170 mm. Heating power 1400 W, temperature range 50 - 350 °C.
on stock
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Bottom heater module NP34-24 Pro

Preheater NP 34-24 Pro with a heating surface of 340 x 240 mm. Heating power 2800 W, temperature range 50 - 350 °C. Two heating zones.
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Dual-loop pulse Tweezers DIP-65

Soldering/Desoldering ceramic chip capacitors
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Heat Shield K-17

Very basic but effective device helps to concentrate and keep a heat radiation in a soldering process zone. Length of longer side 17 cm.
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PCB Clamp Bracket Holder RD-400

For fixing big dimensions boards duding a reworking process the PCB Clamp Bracket Holder is available. Ergonomic and rigid design allows not undesired moves and let operator concentrate at his work.
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PTFE braces FSK-15

PTFE braces for installation of processed PCB to preheater's plate.
on stock
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Solder paste dispenser ND-35

Solder Paste Dispenser with integrated Vacuum Pick-Up.
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